At First Tech Communications USA (Georgia), the sourcing and supply of telecommunications equipment, including Central Office, Switching, Transmission, Wireless, and Data Networking Equipment, is what we know best. We support Access Servers, ATM Switches, Bridges, Central Office, Central Office Switching, Channel Banks, CDMA Mod Cells, Circuit Packs, Complete Systems, Controllers, CSU/DSU, CWDM Equipment, Expansion/Upgrades, Data Networking, CDMA Microcells, Digital Cross Connect, DSLAM, DSX Panels, DWDM Equipment, Echo Cancellers, Fiber Loop Connectors, IP Switches, Local Switches, Memory Expansion/Upgrades, Modems, Microwave Radios, Multiplexers, Optical Cross Connect, Patch Panels, PBX Switches, Processor Boards, Rectifiers, Routers, Switching Equipment, Switches Class 4 5, SONET/Fiber Optic, T1/E1 Interface, Transcoders, Transmission, Voice Mail Systems, WAN Switches, Widebanks, Wireless and Wireless Equipment.

Forsk is a leading provider of RF planning software solutions (Atoll) for the wireless industry, with offices in France, the US and China. Forsk markets its solutions directly and through a global network of distributors and partners. Our customers are wireless operators, equipment suppliers and consulting firms from over more than 60 countries. Atoll is an open and flexible multi-technology RF planning environment that supports GSM/GPRS/EDGE, UMTS/HSPA, CDMA2000 1xRTT/EV-DO, TD-SCDMA, WiMAX/BWA and Microwave Link Planning.

Future Wireless Technologies - a multi-discipline multi-national World-wide team of world class Wireless experts. Company Strength RF Microwave subsystems, equipment, components, devices and materials used in Modems, Receivers, Transmitters, Up- and Down-Converter technology for Wireless applications, Active, Adaptive and Passive Phased Array Antenna technology for Communication and Radar systems - Ground mobile, Ground Fixed and Satellite based Integrated and discrete Silicon, SiGe and GaAs semiconductor devices and fabrication technology, SOC, Integrated Circuits (RFIC, MIC and MMIC) technologies for PA and TxRx chipset. Hybrid Multi-chip (Small Signal Power) Modules and T/R Modules, Microwave Packaging, Interconnects, Thin-film fabrication technology, RF cable technology, Surface Mount technology and PCB assembly technology